Industry

Common Terms for Power Management Chips 20 common terms for power management chips and their explanations: PMIC (Power Management Integrated Circuit)：

Learn A bout T hin F ilm P reparation T echnology in O ne A rticle Thin film epitaxial growth is a key material preparation method that is widely used

What are the types of wafer bonding? As shown in the picture above, let's explain the terms one by one. Bonded permanently The purpose is to form

CH9. Wet etching process Wet etching - mainly using the time etch method How it works The wafer is immersed in an etch solution or the etch solution i

CH7. Structure of dry etching equipment Components of the etching device Pump = It acts to form and maintain the high vacuum state required for thin f

CH5. Types and applications of Plasma, principles of DryEtch Types of plasma Classification by mode of generation DC plasma = Gas is charged between t

CH3. The purpose of the Etch process and the plasma concept The purpose of the Etch process After the pattern is formed on the photoresist (PR) throug

Content CH1. Transister/CMOS Vertical Structure CH2. Definition and term of etching process CH3. The purpose of the Etch process and the concept of pl

This is the basic vocabulary that you will hear and use every day in the fab, and must be understood no matter what department you are in. Fab Explana

PVD (Physical Vapor Deposition) Pretreatment Degas Process (How Much Do You Know About Those Hidden Knowledge Points?) ) Degas (degassing/baking) in t

Thin film deposition equipment, one of the three core equipment of the semiconductor production line. I.What is thin film deposition II. Detailed Intr

TSV P rocess O verview 2.5D/3D packaging technology, as the current cutting-edge advanced packaging technology, has a wide variety of solutions, and w