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Basic concept and scope of WIP WIP is an abbreviation for "Work In Process" and is often translated as "work in progress". It refe

Summary of the evolution of semiconductor process technology from 180nm to 14nm In the evolution of semiconductor processes from 180nm to 14nm, the di

What is die-attach? Die-attach (often referred to as die bonding, patch or die bonding in Chinese) is the first physical assembly process that is extr

The Temperature Cycling Test (TCT) is the most core, demanding, and most common test in the Reliability Test of semiconductor packaging. It has only o

As the core platform for material deposition in integrated circuit manufacturing, thin-film growth equipment has a technological evolution closely tie

The development process of film growth process As a key process for adhering substances to the surface of substrate materials by physical or chemical

Magnetron sputtering is a widely used physical vapor deposition (PVD) process that is the primary thin film deposition method for the fabrication of s

PVD-Sputter, or sputter coating technology in physical vapor deposition, is a process that uses high-energy particles to bombard a solid target, causi

Definition and purpose of pre-simulation and post-simulation Pre-simulation, also known as functional simulation, behavior simulation, or RTL simulati

Magnetron sputtering is a widely used physical vapor deposition (PVD) process that is the primary thin film deposition method for the fabrication of s

1. Review: Single transistor structure The formation of a string Let's start with the most basic unit, the formation of strings, also known as str

This article mainly introduces the process of plasma material modification. What is plasma modification? Plasma modification refers to the use of free