Why the TGV Process Chose to Punch Holes in the Glass？

The TGV (Through Glass Via) process is mainly chosen to punch holes in glass because glass has unique advantages over silicon in the following five aspects.

1. Low electrical loss

Advantages：

Glass has excellent electrical insulation;

Low loss under high-frequency signals, suitable for radio frequency (RF), high-frequency, high-speed I/O applications;

Result：

Improved signal isolation;

Reduce system power consumption;

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2. The coefficient of thermal expansion is adjustable

Advantages：

Glass can achieve a variety of CTEs through composition adjustment;

Easier to match silicon chips;

Result：

Improve package reliability;

Warpage or cracks caused by thermal stress mismatch can be avoided when used as a carrier plate/interposer.

3. Smooth Surface, Conducive to Fine Line Widths

Advantages：

Glass has a native smooth surface that does not require complex polishing; More suitable for fine wire/narrow pitch routing;

Result：

Supports smaller package sizes;

Fewer metal layers → reduce the number of wiring layers and manufacturing costs.

4. Good Rigidity and High Flatness

Advantages：

Compared to organic materials (such as FRP), glass is more rigid;

It is not easy to deform and has excellent flatness;

Results：

Support high-precision graphics and fine-line routing; Maintain consistency and verticality during TGV machining.

5. Suitable for direct forming

Advantages：

The finished product can be made directly with the target thickness;

No need for subsequent grinding and polishing;

Results：

Higher yield and lower cost; More efficiency and advantages in panel-level packaging.
The TGV process is well suited for next-generation high-frequency, high-density, and low-power packaging, especially in 2.5D/3D IC interposers and panel-level packaging (PLP).