Common knowledge about Endura 5500 PVD repair and cavity consumables.

The Applied Material Endura® 5500 PVD is a multi-cavity device for preparing thin films of metals, alloys, and metal compounds using physical vapor deposition sputtering .

The system deposits interconnect-metallized thin films on a 6-inch substrate.

I. So what are Physical Vapor Deposition (PVD) and sputtering processes?

Physical vapor deposition ( PVD) is a method that involves vaporizing metal into atoms or molecules, or ionizing it into ions, under vacuum conditions and depositing them directly onto the surface of a workpiece. The main PVD methods include evaporation deposition, sputtering deposition, and ion plating. These methods can deposit titanium, aluminum, and certain high-melting-point materials. By introducing reactions into PVD (called reactive PVD), thin layers of compounds such as SiC and TiC can be manufactured. These ceramic thin layers possess special properties such as wear resistance and heat resistance, and have important applications.

Sputtering is a process in which gas is ionized under certain vacuum conditions to form plasma. Positively charged gas ions bombard the target cathode, and the sputtered target atoms and other gas particles are transferred to the substrate surface to form a thin film.

II. Key Features of Endura 5500 PVD

1. Security : The load-lock door closes under starting pressure, preventing personal injury or equipment damage caused by fingers or foreign objects being placed at the edges of the door and chamber when closing.

2. Improve electromigration resistance by using ultra-high voltage 10⁻⁹ torr to produce purer and more uniform thin films;

3. Improved step coverage and migration. Ensures uniform film adhesion;

4. Low-pressure pre-cleaning, used to clean dirt from the wafer surface.

5. Reduce particulate matter – through proprietary patented Anti-flake shield technology

6. Applicable to 6- inch wafers

III. Application Areas / Processing Procedures / Main Features / Product Advantages

Endura 5500 PVD sputtered films have the advantages of good adhesion, strong step coverage, and easier control of chemical composition when depositing multi-alloy films.

Schematic diagram of the Endura 5500 PVD cavity structure

It can provide up to fourteen cavities:

1. Load lock chamber (2 units )

2. Buffer chamber 1 **​

3. De-gas/wafer orienter chamber 1个*

4. Pre-clean chamber 1个**

5. Transfer chamber 1个**

6. Ultra-high vacuum PVD chambers 1-4 *

7. High vacuum process chambers 1-2个 *

8. Cooldown chambers (1 internal ,1 external ) 2个

**The chamber is built into the main body of the system; the chamber is attached to the main system externally. Up to 8 chambers can operate simultaneously, including 4 ultra-high pressure chambers, a wafer calibration chamber, a pre-cleaning chamber, and 2 high pressure chambers.

V. Wafer Processing

1. Ultra-high voltage compatible

2. Wafer transport mechanism

3. Monitoring and Calibration

4. Wafer trays hold wafers.

VI. Pump Transport System

Pump types: buffer, transfer, and process chambers; applicable Cryo pumps

Pre-clean chamber: Turbo pump backed by rotary vane pump

Load lock: Rotary vane pump/ roots blower package

Basic pressure:

1. Ultra-high vacuum PVD chamber 10⁻⁹ torr

2. Transmission chamber 10⁻ ⁸ torr

3. Pre-alignment chamber 10⁻ ⁷ torr

4. Buffer chamber 10⁻ ⁶ torr

5. High vacuum processing chamber 10⁻ ⁶ torr

6. Load lock safety lock 10⁻ ⁵ torr

Load-locked vacuuming and venting: slow pumping and venting less than 100 torr/min

Vacuuming time: With the chamber door closed, the pressure will rise from standard atmospheric pressure to 10⁻ ⁵ torr within 8 minutes.

Exhaust time: from 10⁻ ⁵ torr to atmospheric pressure within 8 minutes

Gas and aerodynamic requirements:

Nitrogen: For processing, nitrogen reaches electronic grade 20 PSI (1.37 bar); for cleaning and drying, nitrogen reaches 15 PSI, 1.03 bar.

Argon: For processing, argon gas reaches 20 PSI, sputtering level; chamber purging reaches 15 PSI.

Air: All pneumatic valve components must operate at 80 PSI (5.5 bar), and dehumidification must reach 20 PSI.

Power requirements: Depending on the number of chambers, a power supply of 200V-480V can be provided.