What Pretreatment Is Required For Wafer Plating?

 

The core goal of wafer plating processing

Remove impurities, remove organic matter, oxide layer, residual glue and other pollution

Activates the surface, enhances the conductivity of the seed layer, and promotes copper reduction

Improves wettability, prevents air bubbles from hanging in the wells/surfaces, and allows liquids to be filled

0020-33806 Upper Chamber Dps + Poly

What are the treatments before plating?

Take electroplated copper, for example

Ashing, plasma ashing. Function: Remove PR residue from the bottom of the plating hole to avoid "poor contact", and on the other hand, modify the seed layer on the surface of the wafer to enhance the adhesion between the plating layer and the seed layer

Wet cleaning, in which the wafer is immersed in concentrated or dilute hydrochloric acid to remove the oxide layer of copper. Copper oxidizes slightly in the air, which increases the adhesion of the plating and avoids leakage.

In a clean room environment, the surface of the wafer generally does not have oil stains, so it is easy to carry out the pretreatment of oil stains.

 

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