What is a Silicon Epitaxial Furnace, a Wet Cleaning Machine, an Oxidation Furnace

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What are the uses of silicon epitaxial furnaces, wet cleaning machines, and oxidation furnaces?
Silicon epitaxial furnaces are used to grow an extremely high-quality monocrystalline silicon epitaxial layer on the surface of a monocrystalline silicon wafer, i.e., silicon epitaxial wafers. Silicon epitaxial wafers have the characteristics of high voltage resistance and low on-resistance, and are mainly used to prepare power devices such as MOSFETs, IGBTs, and transistors, as well as analog chips such as CMOS image sensors (CIS) and power management chips (PMICs).
Wet cleaning machines are used to remove impurities, particles, and organics from the wafer surface to ensure a clean silicon wafer surface, and are commonly used after processes such as lithography, etching, CMP, and ion implantation. Almost all chips need to be cleaned in the manufacturing process, of course, cleaning is divided into plasma cleaning and wet cleaning, plasma cleaning is a dry method, and wet cleaning requires the participation of liquid.

The oxidation furnace is used to grow a dense silicon oxide film(SiO2) on the surface of the silicon wafer, which is generally used for tunneling gates, gate oxidation, silicon local oxidation isolation oxidation pads(LOCOS Pad Oxide), masking oxidation, field oxidation, etc.

What is the Principle of Silicon Epitaxial Furnace, Wet Cleaning Machine, Oxidation furnace?

As shown in the figure above, a type of silicon epitaxial furnace provides the required high temperature through lamp or resistance heating, injects SiHCl₃, hydrogen arsenide (AsH₃) and carrier gas hydrogen (H₂) into the furnace, the gas decomposes at high temperature, and the silicon forms monocrystalline silicon on the surface of the wafer, that is, the silicon epitaxial layer. Dopanes such as arsenic are incorporated in the crystal lattice to alter the conductivity.

As shown in the figure above, it is a wet bench type wet cleaning agent, Wet bench is a device used for cleaning and etching in the semiconductor manufacturing process, the wafer is put into a tank containing a chemical solution, the surface contaminants are removed through chemical reaction, and then the deionized water is rinsed and dried after the cleaning is completed, and the purpose of wet cleaning can be achieved.

As shown in the picture above, it is a vertical oxidation furnace. There are several ways of oxidation, such as dry oxygen, wet oxygen, TEOS oxidation, etc., here take dry oxygen oxidation as an example, the oxidation temperature in the oxidation furnace is between 800 °C and 1200 °C, oxygen (O₂) is passed into the oxidation furnace, the silicon wafer is placed on the quartz pedestal (Quartz pedestal), and the high temperature environment in the furnace promotes the chemical reaction between oxygen and silicon (Si) on the surface of the silicon wafer to generate SiO2 film.
Silicon Epitaxial Furnace, Wet Cleaning Machine, Oxidation Furnace at Home and Abroad?
Silicon epitaxial furnace
Abroad: United States CVD Equipment, United States GT, France Soitec, France AS, United States Applied Materials.

Domestic：The 48th Institute of China Electronics Technology Group,Hefei Kejing Material Technology Co., Ltd
Wet cleaning machine

Abroad：LAM,TEL,AMAT,SCREEN Etc.

Domestic：Many
Oxidation furnace

Abroad：Lam Etc.
Domestic：NAURA and so on