What Coating Methods can Grow Single Crystal Thin Films?

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What is the difference between CVD, PVD, and epitaxial equipment?

Category of CVD, PVD and epitaxial process

CVD,PVD,?
CVD：LPCVD,APCVD,SACVD,PECVD,HDPCVD,FCVD,MOCVD, etc.
PVD：Electron beam evaporation, magnetron sputtering, PLD (pulsed laser deposition), etc.

Epitaxial：Molecular beam epitaxy MBE, gas phase epitaxy VPE, liquid phase epitaxy LPE, solid phase epitaxy SPE, etc

Among them, CVD, PVD, and epitaxy are similar in principle, and there are many ways to classify them, and the above is my classification method.

Film-forming Mechanism of CVD,PCVD and Epitaxial?

As shown in the figure above, it is no wonder that the above three methods of thin film deposition are the above:

2D layer-by-layer growth modeIn this coating method, the growth of the thin film is carried out layer by layer, and each layer of atoms or molecules completely covers the surface of the wafer before the next layer begins. This growth mode can result in very flat film surfaces, such as superlattice structures.

3D island growth (Volmer-Weber)

In this mode, the growth of the film is no longer layer-by-layer, but rather the formation of discontinuous islands in some localized areas of the wafer surface, which gradually increase and eventually cover the entire wafer. The interaction force between the resulting film and the substrate is weak, and the surface free energy of the film is large.

Mixed mode growth In this growth mode

The film will initially grow layer by layer for a period of time, and when it reaches a certain thickness, due to the accumulation of stress, it begins to form an island-like structure. Generally speaking, the methods that can grow single crystal thin films include molecular beam epitaxy MBE, gas phase epitaxy VPE, liquid phase epitaxy LPE, solid phase epitaxy SPE, MOCVD, PLD (pulsed laser deposition). The 2D layer-by-layer growth mode makes it easier to form monocrystals, while CVD and PVD can be used to generate polycrystalline or amorphous crystals by adjusting process conditions.