Processing Process Of Semiconductor Parts

The processing technology of semiconductor parts includes cutting, drilling, etching, deposition and other processes. Among them, cutting is a basic step in the manufacturing of semiconductor parts. Large silicon wafers are cut into small chips through mechanical separation. Drilling is to connect the circuits between various devices when manufacturing integrated circuits, and punch holes through chemical processing. Etching is a targeted process that can be used to remove unwanted silicon layers or form a required silicon oxide film layer. In addition, deposition is also an important process in the manufacturing of semiconductor parts, mainly achieved through chemical reactions and electrochemical mechanisms.