0020-34694 Liner, Gdp, R2 Oxidegeco

# 1. 0020-34694

- In semiconductor equipment, these numbers typically correspond to a liner, gas distribution plate (GDP), or other critical consumables used in processes such as etching, chemical vapor deposition (CVD), or atomic layer deposition (ALD).

# 2. Liner

- Purpose: Protects the walls of the reaction chamber and prevents the deposition or corrosion of by-products during the process, extending the life of the equipment.

- Materials: May be made of high-purity quartz, ceramics (e.g., Al₂O₃, Y₂O₃) or special coatings that need to withstand high temperatures and plasma environments.

# 3. GDP(Gas Distribution Plate)

- Function: Homogeneous distribution of reactive gases in plasma processes such as etching or deposition ensures uniformity in wafer surface treatment.

- Key parameters: hole design, material (possibly silicon carbide or anodized aluminum), and plasma corrosion resistance.

# 4. R2 Oxidegeco

- It may be the code name or formulation name of an Oxide process, e.g.

- Oxide Etch or Oxide Deposition.

- "Geco" may refer to a combination of process parameters (e.g. gas chemistry, pressure, temperature, etc.)

- If etching is involved, fluorine-based gases (e.g., CF₄, C₄F₈) or Remote Plasma technology may be used.

# Background

- These components/processes may be used in logic chip or memory fabrication, especially in high dielectric constant (High-k) dielectric deposition, shallow trench isolation (STI), or gate oxide processing.

- R2 may represent a reaction chamber (Reactor 2) or a second-generation process (Revision 2).

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