0020-42285 PLATE,BLOCKER 8" EC WXZ

Part Number: 0020-42285

Type: PLATE, BLOCKER Size: 8" (200mm)

Applicable Process: EC (Etch Chamber) WXZ (may be used for specific etch chamber models)

--- # Key Features & Functions

Designed for: - Used inside the etch process chamber as a physical barrier around the wafer or in critical areas to prevent damage to sensitive components by plasma or etch by-products. - May be used to control etch uniformity or to protect the inner wall of the cavity to reduce particle contamination.

Material and Construction:

- Body Material: Corrosion-resistant alloys (e.g., Hastelloy), anodized aluminium (Al Anodized), or ceramic coatings may be used to resist etching gases (e.g., Cl₂, CF₄) and plasma.

- Surface Treatment: May have special textures or coatings (e.g., Y₂O₃, Al₂O₃) to improve adhesion resistance and extend service life.

- Structural design: may be detachable modular design for easy maintenance and cleaning.

Compatibility: - Compatible with 8-inch etching equipment (e.g. Centura or DPS series), refer to the device model "WXZ" designation.

- Suitable for high vacuum (≤10⁻⁶ Torr) and high temperature (≤200°C) environments.

Performance Advantages: - Reduced particle contamination: Blocks etching by-product deposition and improves wafer yield.

- Extended cavity life: Protects the components inside the cavity from plasma damage. - Process stability: Optimized plasma distribution ensures etch uniformity.

--- # Application Scenario

- Si Etch: Prevents sidewall over-etching or micro-loading effects.

- Dielectric Etch: Protects the inner wall of the chamber from corrosion by fluorine-based gases. - Metal Etch: Reduces the deposition of metal residues.

--- # Maintenance & Installation Precautions

- Regular cleaning: Cleaning with a specified solvent (e.g., IPA) or dry ice to remove deposits, depending on process accumulation.

- Check for wear: monitor the condition of the surface coating and replace it in time if it appears to peel or crack.

- Mounting calibration: Ensure alignment with other components of the chamber to avoid gaps that could lead to plasma leakage.

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